Reflow Soldering

Category: science

The process of heating a circuit board to melt solder paste and form permanent electrical connections for surface-mounted devices.

Reflow soldering requires strict adherence to precise thermal curves. If the board is heated too quickly or unevenly during a repair rework, the internal trace layers can delaminate, or components can experience "tombstoning"—where a micro-resistor lifts off one pad and stands vertically.

Common Examples

• We adjusted the infrared pre-heater settings to avoid thermal shock profiles during the final reflow soldering phase.
• A poor reflow soldering attempt can bridge adjacent pins beneath a chip, creating an immediate short to ground.